View FSUSB2306_1243199.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
March 2006
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Features
10A maximum ICCT current over an expanded control
General Description
The FSUSB23 is a low power high bandwidth analog switch specifically designed for high speed USB 2.0 applications. The FSUSB23 features very low quiescent current even when the control voltage is lower than the VCC supply. This feature services mobile handset applications well allowing for direct interface with the baseband processor general purpose I/Os. Typical applications involve switching in portables and consumer applications such as cell phones, digital cameras, and notebooks with hubs or controllers. The wide bandwidth (>720MHz) of this switch exceeds the bandwidth needed to pass the 3rd harmonic which results in signals with minimum edge and phase distortion. Superior channelto-channel crosstalk results in minimal interference.
voltage range (VIN = 2.6V, VCC = 3.6V) Lower Capacitance: Con = 9pF Typ 7 typical On Resistance (RON) -3dB bandwidth: > 720MHz Low power consumption (1A maximum) Packaged in: Pb-Free 10-lead MicroPak (1.6mm x 2.1mm) Pb-Free 16-lead DQFN Pb-Free 10-lead MSOP 7kV I/O to GND ESD performance
Applications
Cell phone, PDA, Digital Camera, and Notebook LCD Monitor, TV, and Set-top Box
Ordering Information
Order Number
FSUSB23L10X FSUSB23BQX FSUSB23MUX (Preliminary)
Package Number
MAC010A MLP016E MUA10A
Product Code Top Mark
EZ USB23 USB23
Package Description
Pb-Free 10-Lead MicroPak, 1.6mm x 2.1mm Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Pb-Free 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
Pb-Free package per JEDEC J-STD-020B.
MicroPak is a trademark of Fairchild Semiconductor Corporation.
(c)2006 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FSUSB23 Rev. 1.0.0
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Connection Diagrams
Pad Assignments for MicroPak
D1- D2- OE
Analog Symbol
D1+ D2+ D1- D2- S Control D+ D-
9
8
7
D-
6
OE
VCC
10
5
GND
1
2
3
4
Pin Descriptions
Pin Name
OE S D+, D-, Dn+, Dn-
S
D1+
D2+
D+
Description
Bus Switch Enable Select Input Data Ports
(Top View)
Pad Assignments for DQFN
S
1
VCC
16 15 14 13 12 11 10
Truth Table/s
OE
D1+ D2+ D+ NC NC NC
2 3 4 5 6 7 8 9
S
D1- D2- D- NC NC
OE
H L L
Function
Disconnect D+, D- = D1n D+, D- = D2n
X L H
GND NC
(Top Through View)
Pin Assignment for MSOP
S D1+ D2+ D+ GND VCC OE D1- D2- D-
1
10
2 3 4
9 8 7
5
6
(Top Through View)
2 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Absolute Maximum Ratings
The "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The "Recommended Operating Conditions" table will define the conditions for actual device operation.
Symbol
VCC VIN Supply Voltage DC DC Switch Voltage(1) Input Voltage(1)
Parameter
Rating
-0.5V to +4.6V -0.5V to VCC + 0.5V -0.5V to +4.6V -50mA 50mA -65C to +150C 7kV 7kV
DC Input Diode Current DC Output Current Storage Temperature ESD (Human Body Model) All Pins I/O to GND
Recommended Operating Conditions(2)
Symbol
VCC Supply Voltage Control Input Voltage Switch Input Voltage Operating Temperature Thermal Resistance 10 MicroPak
Parameter
Rating
3.0V to 3.6V 0V to VCC 0V to VCC -40C to +85C 250C/W
Notes: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V. 2. Control input must be held HIGH or LOW and it must not float.
3 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
DC Electrical Characteristics
(All typical values are @ 25C unless otherwise specified.)
TA = -40C to +85C Symbol
VIK VIH VIL IIN IOZ RON RON RON Flatness ICC ICCT
Parameter
Clamp Diode Voltage Input Voltage HIGH Input Voltage LOW Control Input Leakage OFF State Leakage Switch On Resistance(3)
Conditions
IIN = -18mA
VCC (V)
3.0 3.0 to 3.6 3.0 to 3.6
Min.
1.2
Typ.
Max. Units
-1.2 0.50 1.0 1.0 V V V A A 1.0 10.0 A A
VIN = 0V to VCC 0 Dn, D1n, D2n VCC VIN = 0.4V, ION = -8mA VIN = 0.8V, ION = -8mA VIN = 0.8V, ION = -8mA VIN = 0.0V - 1.0V, ION = -8mA VIN = 0.0V or VCC, IOUT = 0 VIN = 2.6V, VCC = 3.6V
3.6 3.0 3.0 3.0 3.6 3.6 6.0 7.0 0.3 2.0
9.0 10.0
Delta RON(4) RON Flatness(3)
Quiescent Supply Current Increase in ICC Current per Control Voltage and VCC Levels
AC Electrical Characteristics
(All typical values are for VCC = 3.3V @ 25C unless otherwise specified.)
TA = -40C to +85C Symbol
tON tOFF tPD OIRR Xtalk BW
Parameter
Turn On Time S, OE to Output Turn OFF Time S, OE to Output Propagation Delay(4) OFF Isolation (Non-Adjacent) Non-Adjacent Channel Crosstalk -3dB Bandwidth
Conditions
VD1n, D2n = 0.8V, RL = 50, CL = 10pF VD1n, D2n = 0.8V, RL = 50, CL = 10pF RL = 50, CL = 10pF f = 250MHz, RT = 50 RT = 50, f = 250MHz RT = 50
VCC (V)
3.0 to 3.6 3.0 to 3.6 3.3 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6
Min.
Typ.
10.0 8.0 0.25 -30.0 -43.0 720
Figure Max. Units Number
13.0 11.0 ns ns ns dB dB MHz Figure 5 Figure 5 Figure 3 Figure 4 Figure 8 Figure 9 Figure 7
Notes: 3. Measured by the voltage drop between Dn, D1n, D2n pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two ports. 4. Guaranteed by characterization.
4 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
USB Related AC Electrical Characteristics
Symbol
tSK(O) tSK(P)
Parameter
Channel-to-Channel Skew(5) Skew of Opposite Transitions of the Same Output(5) Total Jitter(5)
Conditions
RL = 50, CL = 10pF RL = 50, CL = 10pF
VCC (V)
3.0 to 3.6 3.0 to 3.6
TA = -40C to +85C Min. Typ.
40.0 20.0
Figure Max. Units Number
ps ps Figure 3 Figure 6 Figure 3 Figure 6
tJ
RL = 50, CL = 10pF, 3.0 to 3.6 tR = tF = 750ps at 480 Mbps (PRBS = 215 - 1)
150
ps
Note: 5. Guaranteed by design.
Capacitance
TA = -40C to +85C Symbol
CIN CON COFF
Parameter
Control Pin Input Capacitance D1n, D2n, Dn ON Capacitance D1n, D2n OFF Capacitance
Conditions
VCC = 0V VCC = 3.3, OE = 0V VCC and OE = 3.3
Min.
Typ.
2.0 9.0 4.0
Figure Max. Units Number
pF pF pF Figure 11 Figure 10 Figure 11
5 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Test Diagrams
VON FSUSB23 NC Dn VIN GND Select VS = 0 to VCC RON = VON / ION GND ION Select GND VS = 0 or VCC Note: Each switch port is tested separately. IDn(OFF)
FSUSB23 D1n, D2n
A
VIN
Figure 1. On Resistance
Figure 2. OFF Leakage
FSUSB23 D1+, D1- D+, D- VIN GND RS CL GND VSel GND Output: D+, D- Note: RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). Note: CL includes test fixture and stray capacitance. VOL tPLH tPHL VOH
50% 50%
tRISE = 500ps RL VOUT 800mV Input: Dn+, Dn- 400mV
10% 90% 50% 90% 50%
tFALL = 500ps
10%
Figure 3. AC Test Circuit Load
Figure 4. Switch Propagation Delay Waveforms
tRISE = 2.5ns VCC Input - S, OE GND
10% 90% VCC/2 90% VCC/2
tFALL = 2.5ns
10%
VOH Output - VOUT VOL tON
90%
90%
tOFF
Figure 5. Turn ON/Turn OFF Waveform
6 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Test Diagrams (continued)
tRISE = 750ps 800mV Input: D+, D- 400mV tRISE = 750ps 800mV Input: Dn+, Dn- 400mV
10% 90% 50% 10% 90% 50% 90% 50% 10%
tFALL = 750ps
tFALL = 750ps VOH Output1: D1+, D1- VOL
10%
90% 50%
50%
50%
tPLH1
tPHL1
VOH Output: D+, D- VOL tPLH TSK(P) = | tPHL - tPLH | Pulse Skew, TSK(P) tPHL
50% 50%
VOH Output1: D2+, D2- VOL tPLH2 tPHL2
50% 50%
TSK(OUT) = | tPHL1 - tPHL2 | or | tPLH1 - tPLH2 | Output Skew, TSK(OUT)
Figure 6. Switch Skew Tests
Network Analyzer FSUSB23 VIN GND VSel GND VOUT GND Note: RS and RT are functions of the application environment (See AC Electrical Tables for specific values). RT GND RS VS GND
Figure 7. Bandwidth
Network Analyzer FSUSB23 VIN RT VSel GND GND GND OFF-Isolation = 20 Log (VOUT / VIN) VOUT RT GND GND RS VS GND
Figure 8. Channel OFF Isolation
7 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Test Diagrams (Continued)
NC FSUSB23 VIN GND VSel GND RT GND Network Analyzer RS VS GND
GND RS and RT are functions of the application environment (50, 75 or 100)
RT GND
VOUT
Crosstalk = 20 Log (VOUT / VIN)
Figure 9. Non-Adjacent Channel-to-Channel Crosstalk
Capacitance Meter F = 1MHz
Dn
FSUSB23 S VSel = 0 or VCC Capacitance Meter F = 1MHz
Dn
FSUSB23 S VSel = 0 or VCC D1n, D2n
D1n, D2n
Figure 10. Channel ON Capacitance
Figure 11. Channel OFF Capacitance
8 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Tape and Reel Specifications
Tape Format for MicroPak Package Designator
L10X
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ) 5000 75 (typ)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
Tape Dimension millimeters
9 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimension for MicroPak inches (millimeters)
Tape Size
8mm
A
7.0 (177.8)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
2.165 (55.00)
W1
0.331 +0.059/-0.000 (8.40 +1.50/-0.00)
W2
0.567 (14.40)
W3
W1 +0.078/-0.039 (W1 +2.00/-1.00)
10 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Tape Format for DQFN Package Designator
BQX
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ) 2500/3000 75 (typ)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
Tap Dimensions millimeters
11 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimensions for DQFN inches (millimeters)
Tape Size
12mm
A
13.0 (330)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
7.008 (178)
W1
0.488 (12.4)
W2
0.724 (18.4)
12 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions millimeters unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6mm x 2.1mm Package Number MAC010A
13 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions millimeters unless otherwise noted
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016A
14 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions millimeters unless otherwise noted
SEE DETAIL A
DETAIL A
Pb-Free 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide Package Number MUA10A
15 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM E2CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM
DISCLAIMER
ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM
PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3
SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDiS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I18
16 FSUSB23 Rev. 1.0.0
www.fairchildsemi.com

▲Up To Search▲

Price & Availability of FSUSB2306

	To Download FSUSB2306 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .